Tin Whisker Mitigation

by <a href="http://community.silabs.com/t5/Welcome-and-Announcements/Community-Ranking-System-and-Recognition-Program/m-p/140490#U140490"><font color="#000000"><font size="2">Hero Employee</font></font> </a> Silicon_Labs on ‎12-17-2013 07:49 PM - edited on ‎08-15-2014 02:13 AM by Administrator Nari
Question

 

What tin whisker mitigation methods are used by Silicon Labs on RoHS devices?




Answer

 

All Silicon Labs MCUs use 100% matte tin (Sn), plated to a thickness of 10 um minimum, and annealed (within 4 hours after plating) for 1 hour at 150 degrees C.




More Information

 

You can find the complete MDDS data for each device here:
https://www.silabs.com/support/quality/Pages/RoHSInformation.aspx