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04-20-2017 06:20 PM
It would be incredibly helpful if the datasheet included a table listing each pad, its dimension and its location (center of the pad). This is a complex asymmetrical footprint and anything you can do to make it easier to layout will be appreciated. Extracting pad location from figures 8.3 and 8.1 is tedious. For instance what is the Y location of the row of pads containing pad 10 through 22? You have to go to the package dimension and back it out from the distances from the package to the edge of the pad.
Also the drawings are blurry.
Well, I feel better now.
Solved! Go to Solution.
04-21-2017 06:20 AM
You can find the design files of BRD4302A here:
Since this board carries a BGM121, you can obtain and reuse the footprint from it.
04-21-2017 10:19 AM
I think the sign is missing from the x dimension for pads 8 and 10. Are pads 42 and 43 the same size as pad 41? Is pad 44 the same size as 50?
Finally do you have expansion values for the solder mask and paste mask?
Thanks again for the excellent customer service.
04-21-2017 01:33 PM
I am using the footprint for the BGM121/123 from the recommended zip file BRD4302A BGM121 Wireless Starter Kit and have notice that the trace spacing between pin 53 and 54 is 0.4mm where the recommended spacing on page 43 of the spec is 0.3mm. Is this significant?
04-25-2017 06:30 AM
Yes, you're right, those should be negative number there, thanks for the feedback. FYI: the datasheet will be updated with these pieces of info soon.
Pads 42 and 43 have the same size as pad 41, and pad 44 has the same size as 50.
The updated datasheet will also include recommendations for the solder and pasta masks.
05-03-2017 09:57 AM
The datasheet has, as far as I can tell, still not been updated. I would like to use this product in a design, but not having land pattern information is severely hindering the design process. Any chance we can get a complete document? I've never seen a datasheet with incomplete land pattern information before.